Grain boundary mediated plasticity: The role of grain boundary atomic structure and thermal activation

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Authors

Institutes & Expert groups

  • UPC - Universitat Politècnica de Catalunya
  • ANSYS
  • EPFL - École polytechnique fédérale de Lausanne

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Abstract

The interaction of dislocation pile-ups with several tilt grain boundaries (GB) is studied in copper by using a hybrid continuum-atomistic approach. The effects of temperature, pile-up intensity and GB structure on absorption and transmission of slip as a function of local stress state are explored. By considering several high-angle GBswith different misorientation angles, we demonstrate that GB atomic structure primarily defines its ability to accommodate incoming pile-up dislocations, thus limiting the direct transmission of pile-ups through the interface.

Details

Original languageEnglish
JournalScripta Materialia
Volume145
Issue number1-4
DOIs
Publication statusPublished - 4 Oct 2017

Keywords

  • Dislocations, grain boundary, plasticity

ID: 3368047